How will you handle the heat?

Remove it with our High Density Liquid Cooling Package

Developed to remove high levels of waste heat from server enclosures, our High Density Liquid Cooling Package (LCP) can remove up to 20 kW waste heat per enclosure or up to 30 kW with the LCP Plus.  The LCP is an air/water heat exchanger providing uniform, effective and affordable cooling for servers and similar IT equipment. 

The unique horizontal airflow of the LCP provides cooled air uniformly throughout the entire height of the enclosure.  The LCP is a scaleable cooling concept that can be designed to meet your facility’s requirements.

Cooling and heat removal, in the Data Center and at the enclosure level, have quickly become the most critical factors in Data Center design.  With the exponential increase in deployed servers, heat loads have almost quadrupled in the last seven years, leaving today’s facilities unable to remove such high levels of waste heat with conventional Computer Room A/C (CRAC/HVAC) units.  Earlier facilities were designed to support loads of 50 to 100 watts/sq ft, today’s facilities need to support up to 200 watts/sq ft and more. 

Twenty plus years of industry experience and carefully monitoring Data Center trends has culminated in the development of a truly unique approach to managing the IT infrastructure Equipment and Support environment. 

Data Center Managers are challenged to seek solutions in handling extreme heat loads to protect their equipment and infrastructure.  Titan Power understands mission critical infrastructure support systems must be designed to integrate and interact seamlessly within a Data Center environment to ensure production, eliminate heat load and maximize enclosure AND floor space for utmost efficiency.

Click here for the LCP White Paper (Adobe PDF)